Taipei, July 1, 2009 (CENS)--Because Apple`s latest iPhone 3GS smartphone is unexpectedly popular with consumers, the firm`s related handset IC (integrated circuit) suppliers have recently increased their contract orders with Taiwanese manufacturers, according to industry sources.

Taiwanese IC chip manufacturers, including Taiwan Semiconductor Manufacturing Co. (TSMC), United Microelectronic Corp., Advanced Semiconductor Engineering Inc., Siliconware Precision Industries Co. and Powertech Technology Inc., are all expected to benefit from iPhone 3GS boom in the third quarter of this year.

iPhone 3G was launched in 22 countries of the world in the third quarter of 2008, and a total of 6.9 million units were sold last year. Despite the global financial tsunami, sales of the handset still reached 4.36 million units in the fourth quarter of 2008 and 3.79 million units in the first quarter of this year.

Featuring versatile functions and integration in systems and backed by strong consumer royalty, Apple has sold over 1 million units of its newest iPhone 3GS edition since its debut, with annual sales estimated to hit 12-13 million units this year. This has driven Apple and related parts suppliers to increase orders with their contract manufacturers.

At present, Infineon Technologies AG, supplier of baseband and radio-on chips and GPS (global positioning system) microcontroller chips for iPhone 3GS, has already boosted contract orders with United Microelectronic, Advanced Semiconductor and Siliconware, while Broadcom Corporation has also increased its orders for 802.11a/b/g standard-based wireless network chips and Bluetooth chips with Taiwan Semiconductor.

In the meantime, Toshiba of Japan, supplying 32GB NANA flash memory for iPhone 3GS, has contracted Powertech to test and package the memory, and OmniVision, supplier of 3-megapixel CMOS image sensor, has placed contract orders with TSMC.


(by Steve Chuang)