Taipei, July 15, 2020 (CENS)--Taiwan Semiconductor Manufacturing Co. (TSMC) Chairman and Chief Executive Morris Chang will personally break ground tomorrow for the construction of a 300-mm silicon wafer factory in the Central Taiwan Science Park.

Planned for maximum output of 100,000 wafers a month, this facility is part of TSMC`s plan to fortify its leadership by securing more market share and widening technological gap with rivals. The factory is designed to deploy 40-nanometer process initially and 28-nm process next stage.

The mega factory`s groundbreaking comes amid escalating capacity shortage at the company`s factories, inspiring expectations that the new factory will add growth momentum to the company.

Strained foundry capacity has convinced some of TSMC`s customers to accept a 10-15% price hike. Chang forecast the company`s sales and profit for this year to set new highs.

TSMC will hold an institutional investor conference on July 29 to publicize operation results for the first half.

(by Ken Liu)