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Rotary table series & Carriage(Wafer Grinding Machine)
- Model：*JL-200SCG/JL-300SCG
| Model | JL-200 SCG | JL-300 SCG |
|---|---|---|
| Working table diameter | ||
| Working table diameter | ɸ200 | ɸ300 |
| Machine equipment | One spindle/ on rotary table | One spindle/ on rotary table |
| Spindle | ||
| from | Air floating spindle | Air floating spindle |
| Number of spindles(mm) | 1 | 1 |
| Servo motor power | 3.7 kw | 15 kw |
| tool | ψ250 (mm) diamond grinding wheel | ψ250 (mm) diamond grinding wheel |
| Speed(rpm) | Min1000 ~ Max 3000 rpm | Min1000 ~ Max 3000 rpm |
| Z axis | ||
| Stroke | 100 mm | 200 mm |
| Feed resolution | 0.1μm | 0.1μm |
| max. rapid movement speed | 300 mm / min | 300 mm / min |
| Table | ||
| Stroke | Air floating spindle | Air floating spindle |
| Number of table | 1 | 1 |
| Max. speed | 500 rpm | 500 rpm |
| Table size(mm) | φ200 mm | φ300 mm |
| Max. tableload | 15 kg | 20 kg |
| Size | ||
| Machine net weight(Kgs) | 2000 | 3000 |
| Machine floor space(LxWxH) | 1000 (W)×1700 (D)×2100 (H) mm | 1000 (W)×1700 (D)×2100 (H) mm |
| Machining accuracy | ||
| TTV Surface roughness | 1.5 μmRa 0.02μm（FOR wafer） | 1.5 μmRa 0.02μm（FOR wafer） |