IDF's Taipei Session to Highlight Next-Generation Technologies

Taipei, Oct. 9, 2008 (CENS)--Latest mobile technologies will take center stage at the upcoming Taipei session of the Intel Developer Forum (IDF), to be held Oct. 21 and 22 at the Taipei International Convention Center.

Next-generation 45-nanometer microprocessors, notebook platform Calpella and mobile platform Atom will be the themes at this forum. Calpella is the sixth generation of its Centrino processor family. The latest processor is built around Intel's Nehalem architecture and embedded with data-security technology. It can be integrated with WiMAX capability.

Atom is developed for netbook, a device for mobile Internet connection, and consumes less power than predecessors.

Intel Senior Fellow Mark Bohr, the engineer behind 45-nm technology, will make presentation on 45-nm and 32-nm technologies.

The forum will also underscore topics related to system-on-chip, future energy-saving computing platform, sensor, visual computing, and machine learning technologies.

The Taipei event is the third of this forum so far this year. The two others were held in Shanghai and San Francisco. Industry watchers pointed out that the Taipei session is held to mark Taiwan's prominent position as the world's base for OEM-based and ODM-based information-technology productions.

Invited Taiwanese attendees include Asustek Computer Inc., Apacer Technology Inc., Realtek Semiconductor Co., Ltd., Chi Mei Group, Cyber Link Corp. and first timer Faraday Technology Corp.

In addition to Intel's executives and engineers, specialists from Hewlett-Packard (HP), Hynix Semiconductor, Lenovo, Absolute Software, Dow Corning, Phoenix, Microsoft, Samsung, and Sun Microsystems will be keynote speakers at the forum.

Many industry watchers see the forum as an index for assessing the gravity of the impact from the global financial crisis on the global information-technology market of this quarter and next year since Intel is the world's No.1 microprocessor supplier, whose products are widely built into computer, communications equipment and consumer electronics.