TSMC Wins LSI's 28nm Contract

Taipei, Nov. 17, 2010 (CENS)--Silicon IP provider LSI Corp. recently announced it has launched a tailor-made silicon platform using Taiwan Semiconductor Manufacturing Co.'s (TSMC's) HP HKMG 28-nanometer process technology and will put the devices into mass production in the second half of 2011 after offering samples early next year.

Industry executives estimated the contract would help contribute 1-2% of TSMC's revenue goal for the second half 2011. So far, the No.1 pure foundry has secured 28nm contracts from Qualcomm, nVidia and Altera, in addition to LSI.

LSI has been working with TSMC since 2006 to develop business in Taiwan's market for IC design service and silicon IP using 65nm process.

TSMC has projected to set aside around 70% of its 2011 budget for the development of advanced versions of 28nm and 40nm process technologies. So far, the company has introduced 71 28nm tapeouts. Corporate chairman and chief executive, Morris Chang, noted that demand for 28nm foundry is as strong as that for 40nm foundry.

Industry executives estimated that TSMC will retain its crown in foundry market next year with 28nm process moving in position on mass production lines. So far, the company has bagged up to 80-90% of foundry services depending on 40nm process.