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CoB Family - TMG
CoB Family - TMG

Detail Specifications / Descriptions

Features:
Flip Chip wire-free bonding
Low thermal resistance 0.35 °C/W
Leading hot/cold factor 90%
Zhaga compliance dimensions
3-step McAdam color binning
REACH and RoHS compliant

Related Products
Company: TSMC SOLID STATE LIGHTING LTD.

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