Rotary table series & Carriage(Wafer Grinding Machine)

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Model
JL-200 SCG
JL-300 SCG


Working table diameter


Working table diameter
ɸ200
ɸ300


Machine equipment
One spindle/ on rotary table
One spindle/ on rotary table


Spindle


from
Air floating spindle
Air floating spindle


Number of spindles(mm)
1
1


Servo motor power
3.7 kw
15 kw


tool
ψ250 (mm) diamond grinding wheel
ψ250 (mm) diamond grinding wheel


Speed(rpm)
Min1000 ~ Max 3000 rpm
Min1000 ~ Max 3000 rpm


Z axis


Stroke
100 mm
200 mm


Feed resolution
0.1μm
0.1μm


max. rapid movement speed
300 mm / min
300 mm / min


Table


Stroke
Air floating spindle
Air floating spindle


Number of table
1
1


Max. speed
500 rpm
500 rpm


Table size(mm)
φ200 mm
φ300 mm


Max. tableload
15 kg
20 kg


Size


Machine net weight(Kgs)
2000
3000


Machine floor space(LxWxH)
1000 (W)×1700 (D)×2100 (H) mm
1000 (W)×1700 (D)×2100 (H) mm


Machining accuracy


TTV Surface roughness
1.5 μmRa 0.02μm（FOR wafer）
1.5 μmRa 0.02μm（FOR wafer）