Detail Specifications / Descriptions

‧Best choice for BGA Chip Replacement Processing. Combining with fixture, it is simple and fast to replace solder ball on chips within 3 minutes.
‧Excellent warm effect to BGA chip before formal replacement work.
‧Built-in advanced plate-type heater: convenient and effective solution for the various soldering and desoldering work on SMD and BGA chips.
‧Optimum for PC Board preheating, multi-varied small soldering production and general maintenance on small/middle-size PC Board.