Double-sided Lapping / Polishing Machine

JL-D16
The JL-D16 double-sided grinding machine is an efficient surface processing device designed for various non-metallic and hard materials. It is suitable for surface processing of commonly used materials in semiconductor manufacturing, such as silicon wafers, quartz, silicon carbide, glass, and more.

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The JL-D16 is primarily utilized for double-sided grinding or polishing of flat workpieces. It can also be employed for processing workpiece thicknesses, with a minimum achievable thickness of 0.4mm. Additionally, the surface precision can reach 0.3μm, ensuring a high level of machining accuracy.

The innovative JL-D16 double-sided grinding machine combines both double-sided grinding and polishing functions, making it a comprehensive and efficient solution for surface treatment applications.

-Features
1.Grinding Mechanism: The lapping mechanism running is designed with a planetary type design to achieve the optimal lapping performance and surface finish.
2.Dual Functionality in One Machine: It can simultaneously perform double-sided grinding or polishing for flat workpieces, with a minimum processing thickness of 0.4mm. The surface precision can reach up to 0.3μm.
3.Multi-tasking of Workpieces: Five sets of carriers (planetary carriers) are employed to simultaneously hold multiple workpieces during the lapping process.
Intelligent Electrical Control System: The machine is equipped with a PLC controller, optionally 4.complemented by a touchscreen, ensuring user-friendly operation.

-Optional Accessories
The automatic thickness control.
PLC controller in combination with the use of the touchscreen.

-Application
Surface Treatment of Non-metallic and Hard Brittle Materials: Includes silicon wafers, quartz, SiC, glass, sapphire, ceramic substrates, as well as processing metallic materials such as aluminum, stainless steel, and mechanical seals.