Detail Specifications / Descriptions
Continuing the superior characteristics of vertical grinding, Vertical Semiconductor Grinding Machine features an innovative air-floating spindle, primarily designed for precision grinding of hard and brittle materials that demand high surface accuracy and flatness.
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The overall grinding machine body is based on a high-rigidity welded structure, ensuring exceptional stability. Combined with the special non-contact design of the precision spindle, it significantly reduces mechanical vibration and noise.
Equipped with the advanced Fanuc Oi controller, it enables high-precision mechanical motion. The wafer surface roughness achieved can reach Ra 0.12 micrometers, ensuring high precision and superior surface smoothness in the machining results.
-Features
1.Air Floating Table: The worktable specifications are divided into 200SGC (8 inches) and 300SCGII (12 inches), with a rotational accuracy of up to 0.1μm. Equipped with ceramic vacuum chucks, this prevents surface scratches and indentations caused by negative pressure during workpiece handling.
2.Hight Precision Spindle: The motor is built in the spindle assembly. The spindle running accuracy reaches 0.1 μm. Variable spindle speed ranges from 1000 to 5000 RPM.
3.Main Structure: High-rigidity welded structure, offering exceptional stability to ensure reduced vibrations during the machining process and effectively enhance grinding precision.
Electrical Control System: Equipped with the advanced Fanuc Oi controller, it enables high-precision mechanical motion.
-Standard Accessories
1.Diamond grinding wheel.
2.Flange.
3.Ceramic vacuum suction table.
4.Spindle temperature controller.
5.Vacuum pump.
6.Tool box with tool kits.
-Optional Accessories
1.Precision dryer.
2.Height gauge.
-Application
Brittle Special Composite Materials: This machine is designed for precision grinding for various workplace materials, such as wafers, ceramics, quartz, glass and gems, etc.