TPCA Show 2025 Exhibition × IMPACT 20th Anniversary: Pioneering New Horizons Together

The 26th Taiwan Printed Circuit Association International Exhibition (TPCA Show 2025)—the global PCB industry’s annual flagship event—grandly opened on October 22 at Taipei Nangang Exhibition Center, Hall 1.

Centered on the theme “Energy-Efficient AI: From Cloud to the Edge,” this year’s exhibition spans PCB, SMT, green technology, electronic packaging, and thermal management technologies, setting a new record in both scale and participation. Occupying the first and fourth floors, the show brings together over 670 international brands across 1,750 booths, and is expected to attract more than 70,000 professional visitors over its three-day duration.

Preceding the exhibition, the 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2025) kicked off on October 21, marking its 20th anniversary. The event gathered thousands of global experts in semiconductor packaging and PCB technologies to discuss innovations and trends shaping the AI era.

TPCA Chairman Chang Yuan-Ming emphasized during the opening ceremony that the rapid rise of AI is transforming the structure of the global electronics industry. The surging demand for AI servers, data centers, high-speed networking, and edge computing has propelled the PCB sector into a new phase of prosperity. This year’s TPCA Show again set new benchmarks, showcasing Taiwan’s world-class PCB capabilities on the global stage.

The ceremony also featured a keynote address by Mr. Tseng Tzu-Chang, Chairman of Unimicron Technology Corporation, titled “Opportunities and Challenges for the PCB Supply Chain amid AI System Growth.” His talk provided an in-depth look at how the PCB industry can navigate structural changes and seize opportunities driven by AI expansion.

A series of forums further enriched the exhibition program. On the first day, TPCA joined hands with Business Weekly to host the inaugural “TPCA Show × Business Weekly Leadership Summit,” featuring a powerhouse panel including Yang Chi-Ling, Executive Vice President of Quanta Computer and General Manager of VANTEC; Chang Yuan-Ming, TPCA Chairman and Chairman of Ya Guang Electronics; Li Ding-Chuan, COO of Zhen Ding Technology Group; Dong Ding-Yu, Chairman of Taiwan Optoelectronics; and Dr. Jiang Xu-Gao, Partner at Prismark Partners. The panel explored global industry trends and emerging supply chain opportunities in depth.

On the second day, the Semiconductor and PCB Heterogeneous Integration Summit Forum continued the momentum, featuring Prof. Shih Chin-Tai, Morris Chang Chair Professor at National Tsing Hua University; Hong Chih-Bin, VP of R&D at ASE Group; Shen Ching-Fang, Chairman of Zhen Ding Technology Group; and Chien Cheng-Fu, General Manager of the same group. Their discussion delved into new cross-industry linkages between semiconductor and PCB sectors under the AI-driven revolution, unveiling a forward-looking vision for the global electronics ecosystem.

To thank attendees for their support, TPCA Show will host special activities on October 24 (Friday), including a PCB Talent Matching Session to foster academia–industry collaboration, Häagen-Dazs ice cream giveaways, an iPhone 17 lucky draw, and exclusive shopping vouchers, keeping the excitement alive through the final day.

IMPACT 2025: Celebrating Two Decades of Innovation

Held concurrently, IMPACT 2025 follows the same core theme—focusing on technical challenges and opportunities as AI applications expand from large data centers to edge devices. The conference highlights the pivotal roles of semiconductor packaging, PCBs, IC substrates, and advanced materials in achieving high-performance, energy-efficient solutions.

As Asia’s largest and the world’s most influential packaging and PCB symposium, IMPACT 2025 features 45 thematic forums and over 300 English papers presented by leading experts worldwide.

The opening ceremony and keynote sessions on October 21 took place at the Han Lai Hotel, Nangang, marking the grand start of the conference. After the presentation of Outstanding Paper Awards, three AI industry leaders delivered keynote speeches:

Dr. Frank Lee, VP of TSMC, shared how advanced process technologies enable energy-efficient computing and sustainable AI.

Dr. Babak Sabi, VP of AWS, discussed packaging and system challenges for AI data centers.

Jatin Upadhyay, VP of Intel, focused on innovations in data center architecture and future technology roadmaps.

Global leaders including AMD, Applied Materials, ASE, Intel, Lam Research, MKS’ Atotech, Qnity™, DuPont Electronics, and SPIL also gathered in Taipei, highlighting frontier topics such as AI, heterogeneous integration, glass substrates, and advanced packaging. Dedicated Japan–Korea sessions (JIEP, ICEP, ISMP) offered the latest international perspectives.

For the first time, IMPACT joined hands with TPCA Show to launch an Open Seminar, featuring Applied Materials, Resonac, Sony, Yole Group, and renowned expert Wu Ling-Hsiang, providing deep insights into market dynamics. The SMTA Forum also offered a detailed analysis of advanced packaging and PCB technologies.

To nurture young talent, IMPACT partnered with six major semiconductor universities in Taiwan to debut the “Triple Surprise for Students”—combining master lectures, career matchmaking, and prize giveaways for an integrated learning and networking experience.

The conference also unveiled the “20 Legacy Series”, bringing together global industry elites and next-generation talents in Nangang to embrace a new AI-driven future.